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Patents

Manufacturing Processes for Absorbent Articles with Improved Side Seam Bonding:

U.S. Patent No. 11,219,556

Michael D. Meisner, De Pere, WI; John W. Hoffman, Appleton, WI; and John J. Garcia, Neenah, WI.
Assigned to Kimberly-Clark Worldwide, Inc., Neenah, WI.

Filed: 4/30/18
Issued: 1/11/22

A method of forming absorbent articles; advancing one or more continuous webs in a machine direction, a first region of the one or more continuous webs comprising a front waist panel material and a second region of the one or more continuous webs comprising a rear waist panel material; coupling absorbent cores to the one or more continuous webs intermittently to form an interconnected series of open absorbent article chassis, each absorbent article chassis comprising a front waist panel, a rear waist panel, and an absorbent core extending between the front waist panel and the rear waist panel; folding the interconnected series of open absorbent article chassis to form an interconnected series of closed absorbent article chassis; forming a first side seam bond of a first side seam bond pair between the first region of the one or more continuous webs and the second region of the one or more continuous webs with a first ultrasonic horn; forming a second side seam bond of the first side seam bond pair between the first region of the one or more continuous webs and the second region of the one or more continuous webs with a second ultrasonic horn, wherein the first side seam bond of the first side seam bond pair is associated with a first absorbent article chassis and wherein the second side seam bond of the first side seam bond pair is associated with a second absorbent article chassis; and cutting the interconnected series of folded absorbent article chassis between the first side seam bond and the second side seam bond of the first side seam bond pair to separate the first absorbent article chassis from the second absorbent article chassis, wherein the first ultrasonic horn forms only the first side seam bond of the side seam bond pair and the second ultrasonic horn forms only the second side seam bond of the side seam bond pair.

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